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Complete
Technical
Specifications

View our full list of technical specifications below.

Certified Manufacturer Based in North America

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CGP Registered
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REACH COMPLIANT
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IPC CERTIFIED
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ISO9001:2015 CERTIFIED
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ROHS Lead-Free COMPLIANT
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UL CERTIFIED

Build

Board Types: Rigid, Rigid-Flex, Flex, Metal-Backed, High-Speed
Layer Count: Up to 30 Layers
Board Thickness: Up to .350″
Board Thickness Tolerance: +/- 5% OR +/- .005″
Thickness Across Panel: +/- .004″
Minimum Core Thickness: .002″ RIGID .001″ FLEX
Copper Weight: 0.25oz, 0.5oz, 1oz, 2oz, 3oz, 4oz

Surface Finish

ENIG
ENEPIG
HASL
LF-HASL
IMAG
IMSN
OSP
Carbon Ink
Selective Hard Gold
Full Body Hard Gold

Gold Plating

Gold Purity: 99.7%
Gold Hardness: 130-200 KNOOP
ENIG: 100 Micro Inches of Nickel, 3-6 Micro Inches of Gold
Selective Hard Gold: 100 Micro Inches of Nickel, 35-50 Micro Inches of Gold
Full Body Hard Gold: 100 Micro Inches of Nickel, Gold Thickness As Required

Trace Width / Spacing

Minimum – 0.25oz FOIL: .0025″ / .0025″
Minimum – 0.5oz FOIL: .003″ / .003″
Minimum – 1oz FOIL: .004″ / .004″
Minimum – 2oz FOIL: .006″ / .006″
Minimum – 3oz FOIL: .008″ / .008″
Minimum – 4oz FOIL: .010″ / .010″

Imaging Registration Tolerance

Outer Layer: +/- .003″
Inner Layer: +/- .003″
Solder Mask: +/- .005″

Solder Mask

Color Options: Green, Red, Blue, Black, White
Minimum Web Width – Green: 0.003″
Minimum Web Width – Other: 0.004″ ***0.003″
Minimum Pad Clearance: 0.002″ ***0.001″
Minimum Solder Mask Thickness: 0.0008”

Silkscreen

Color Options: White, Black, Yellow
Minimum Line Width: .005″

Mechanical Tolerance

Board Dimension: +/-.005″
Plated Hole Diameter: +/-.002″
Unplated Hole Diameter: +/-.001″
Warp and Twist: .75% SMT 1.5% NON-SMT

Drill and Rout

Minimum Drill Diameter: 0.0059”
Drill Aspect Ratio: ≤ 10:1
Location Tolerance: +/- 0.0005″
Depth Tolerance: +/- 0.0002″
Plated Hole Tolerance: +/- 0.003″ *** +/- 0.002″
Non-Plated Hole Tolerance: +/- 0.001″
Minimum Drill Pad Size: Hole Size + 0.01″ *** Hole Size + 0.06″
Via Types: Through, Blind, Buried, Stacked
Special Drill: Backdrilling, Countersink, Counterbore, Controlled-Depth
Back-Drill Size: Hole Size + 0.010″ ***Hole Size + 0.006″
Back-Drill Antipad: Hole Size + 0.026″ ***Hole Size + 0.016″
Hole Fill: Non-Conductive Epoxy, Conductive Epoxy, Solder Mask
Special Rout: Milling, Controlled-Depth, Chamfer
Minimum Rout Diameter: .031″

Impedance Control Tolerance

Single-Ended: +/- 10% *** +/- 5%
Differential: +/- 10% *** +/- 5%

*** = Non-Standard Requirement

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Technical Specifications

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