complete
technical
specifications
Artwork Requirements:
Minimum Line Width: 0.0025”
Minimum Space: 0.0025”
Minimum Pad Size (Inner Layer): Finished Hole Size + 0.020”
Minimum Pad Size (External Layer): Finished Hole Size + 0.014” Clearance
Pad Clearance (Min/Side): 0.003
Feature Spacing to Allow Damming: 0.003 LPI
Pads for Non-PTH Holes To Be Removed: < Hole Size + 0.020”
Gold Plating:
Immersion Nickel Gold: 100 Micro inches Nickel, 3-6 Micro Inches Gold
Gold Purity: 99.7%
Gold Hardness: 130-200 KNOOP
Tab Plating
Nickel Thickness: 100 Micro Inches
Gold Thickness 35-50 Micro Inches
Deep Gold
Nickel Plating Thickness: 100 Micro Inches
Gold Plating Thickness: As Required
Copper Plating:
Copper Thickness Tolerance in Hole: 0.0005” – 0.0000”
Maximum Panel Thickness: 0.350”
Maximum Aspect Ratio: 10:1
Inner Layer Imaging:
Minimum Line Width (Finished): 0.0025” On 1/2 OZ. Copper
Minimum Spacing (Finished): 0.0025” On 1/2 OZ. Copper
Minimum Core Thickness (Rigid): 0.002”
Minimum Core Thickness (Flex): 0.001”
Multilayer Lamination:
Maximum Number of Layers: 24
Maximum Finished Panel Thickness: 0.350”
Thickness Tolerance: +-5% or +-0.005” Whichever is greater
Thickness Across Panel: +-0.004”
Warp age: 0.05%
Additional Finishes:
OSP
Silver
hasl
Lead free hasl
Carbon Ink
NC Routing:
Maximum Router Size: 0.125”
Minimum Router Size: 0.031”
Dimensional Tolerance: .005
Drilling:
Location Tolerance: 0.0001
Minimum Drilled Hole Size: 0.006”
Minimum Hole Size Finished: 0.004”
Plated Holes Tolerance: +-0.002”
Non-Plated Holes Tolerance: +-0.001”
Back-Drilling: Hole size +.006”, Antipad +.020”
Control Depth Drilling +- .0002”
Blind/Buried vias .004”
Outer Layer Imaging:
Minimum Line Width on 1/2 OZ. Base Copper (Finished): 0.003”
Minimum Spacing on 1/2 OZ. Base Copper (Finished): 0.003”
Maximum Tented: 0.187”
Registration Tolerance: +-0.003”
Solder Mask Photoimageable:
Plugging Capability: Epoxy Via Plug (Peters SD2361)
Minimum Solder mask Thickness: 0.001”
Registration Tolerance: +-0.005”
Solder Mask Wet
Via-In-Pad
Plugging Capability: Yes (Peters SD2361)
Minimum Solder mask Thickness: 0.0005”
Registration Tolerance: +-0.005”
